s m a l l s i g n a l s w i t c h i n g d i o d e s reverse v oltage: 70 v olts forward current: 200 ma rohs device page 1 rev :e features -design for mounting on small surface. -high speed switching. -high mounting capability , strong surge withstand, high reliability . mechanical data -case: sot -23, molded plastic. -t erminals: solderable p er mil-std-750, method 2026. -approx. weight: 0.0078 grams circuit diagram cdst -99-g/70-g/56-g maximum ratings (at t a=25c unless otherwise noted) qw -b0002 comchip t echnology co., l td. reverse voltage forward current peak surge forward current power dissipation thermal resistance, junction to ambient maximum junction temperature storage temperature units symbol parameter v r i f i fsm p d r ja t j t stg v alue 70 200 500 225 556 150 -55 +150 to v ma ma mw c c c/w 1 2 3 cdst -99-g marking code: a7 1 2 3 cdst -70-g marking code: a4 1 2 3 cdst -56-g marking code: a1 reverse breakdown voltage forward voltage reverse current reverse recovery time diode capacitance units symbol parameter v br v f i r t rr c t conditions max. i r =100 a @i f =1ma @i f =10ma @i f =50ma @i f =150ma @v r =70v i f =i r =10ma, irr=0.1i r , r l =100 v r =0v , f=1.0mhz 0.715 0.855 1.0 1.25 2.5 6 1.5 v v a ns pf min. 70 electrical characteristics (at t a=25c unless otherwise noted) d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) s o t - 2 3 3 1 2 0.1 19(3.00) 0.1 10(2.80) 0.056(1.40) 0.047(1.20) 0.079(2.00) 0.071(1.80) 0.041(1.05) 0.035(0.90) 0.020(0.50) 0.012(0.30) 0.006(0.15) 0.002(0.05) 0.100(2.55) 0.089(2.25) 0.004(0.10) max 0.008(0.20) min
qw -b0002 ra ting and characteristic cur ves (cdst -99-g/70-g/56-g) forward v oltage, (v) 1.5 1.0 0.5 0 fig.1 - forward characteristics 1 10 100 1000 reverse v oltage, (v) 0 fig.2 reverse characteristics - 0.1n 1n 10n 100n 10 40 reverse v oltage, (v) 0 fig.3 capacitance between t erminals - characteristics 0 1 2 30 50 ambient t emperature, (c) fig.4 power derating curve - 0 200 400 comchip t echnology co., l td. page 2 60 100 0 100 175 20 80 100 10 25 50 75 150 125 300 1 40 20 mounted on glass epoxy pcbs s m a l l s i g n a l s w i t c h i n g d i o d e s t a =125c t a =-40c t a =25c t a =75c t j =25c f=1mhz t a =0c 0.1 t a = 1 5 0 c t a = - 4 0 c t a = 2 5 c t a = 7 5 c t a = 0 c rev :e c a p a c i t a n c e b e t w e e n t e m i n a l s , ( p f ) f o r w a r d c u r r e n t , ( m a ) r e v e r s e c u r r e n t , ( a ) p o w e r d i s s i p a t i o n , ( m w )
qw -b0002 page 3 s m a l l s i g n a l s w i t c h i n g d i o d e s rev :e comchip t echnology co., l td. reel t aping specification o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed i n d e x h o l e d e f b w p p 0 p 1 a b c d d d 2 d 1 s o t - 2 3 s y m b o l ( m m ) ( i n c h ) 1 . 9 6 9 ( m i n ) 4 . 0 0 0 . 1 0 1 . 5 5 0 . 1 0 5 4 . 0 0 ( m i n ) 1 3 . 0 0 0 . 2 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 0 5 1 7 8 1 . 0 0 0 . 0 6 1 0 . 0 0 4 7 . 0 0 8 0 . 0 3 9 0 . 5 1 2 0 . 0 0 8 s y m b o l ( m m ) ( i n c h ) 0 . 0 . 0 0 4 1 5 7 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 2 e f p p 0 p 1 w w 1 1 . 7 5 0 . 1 0 0 . 0 6 9 0 . 0 0 4 3 . 5 0 0 . 0 5 0 . 1 3 8 0 . 0 0 2 s o t - 2 3 3 . 1 0 0 . 1 0 0 . 1 2 2 0 . 0 0 4 2 . 8 5 0 . 1 0 0 . 1 1 2 0 . 0 0 4 1 . 4 0 0 . 1 0 0 . 0 5 5 0 . 0 0 4 1 4 . 4 0 ( m a x ) 0 . 5 6 7 ( m a x ) 8 . 0 0 0 . 3 0 0 . 3 1 5 0 . 0 1 2 a
qw -b0002 page 4 s m a l l s i g n a l s w i t c h i n g d i o d e s rev :e part number cdst -99-g marking code a7 marking code xx 3 1 2 suggested p ad layout a c b size (inch) 0.031 (mm) 0.80 1.90 2.02 0.075 0.080 sot -23 2.82 0.1 1 1 a b c d d cdst -70-g a4 cdst -56-g a1 xx = product type marking code comchip t echnology co., l td. standard packaging c a s e t y p e s o t - 2 3 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k
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